The production problem
Thin-gold FPC samples may look acceptable after plating but develop discoloration, local corrosion or exposed underlayer during storage, humidity or corrosion testing.
Diagnostic sequence
- Confirm whether the finish is ENIG or electroplated gold and record the actual gold thickness.
- Review nickel condition, post-plating rinsing and drying before evaluating a protective treatment.
- Use untreated and treated coupons from the same production lot.
- Check downstream soldering, bonding or electrical-contact requirements.
Control direction
- Stabilize the base finish and cleaning process first.
- Select hydrophilic or hydrophobic surface behavior according to downstream processing.
- Compare appearance, corrosion and functional results under identical exposure conditions.
Validation before production release
Microscopic appearance before and after exposure
Salt-spray or damp-heat comparison
Solderability or contact resistance
Adhesion or bonding compatibility when required
What this approach cannot repair
Surface protection cannot replace missing gold or repair exposed copper, severe pitting or a defective nickel/gold deposit.